Silicon Etchants
Nitric Acid Etching Mixture (17693)
SWF 600-388-12 VLSI Puranal
Overview
Specifications
Others
- Grade
- VLSI
- pH
- < 1.0 (20 °C)
- Melting Point/Range
- No data available
- Boiling Point/Range
- > 100 °C (1,013 hPa)
- Physical Form
- Liquid
- Flashpoint
- Not applicable
- Density
- 1.250 g/cm3 (20 °C)
- Color
- Colorless
- Odor
- Weak
- Incompatible Materials
- Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
- Thermal Decomposition
- To avoid thermal decomposition, do not overheat.
- Ignition Temperature
- Not applicable
- Corrosivity
- Corrosive to metals
- Harmonized System Code
- 38249996
- Chemical Class
- 8
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
Others
- Grade
- VLSI
- pH
- < 1.0 (20 °C)
- Melting Point/Range
- No data available
- Boiling Point/Range
- > 100 °C (1,013 hPa)
- Physical Form
- Liquid
- Flashpoint
- Not applicable
- Density
- 1.250 g/cm3 (20 °C)
- Color
- Colorless
- Odor
- Weak
- Incompatible Materials
- Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
- Thermal Decomposition
- To avoid thermal decomposition, do not overheat.
- Ignition Temperature
- Not applicable
- Corrosivity
- Corrosive to metals
- Harmonized System Code
- 38249996
- Chemical Class
- 8
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
- Grade : VLSI
- pH : < 1.0 (20 °C)
- Melting Point/Range : No data available
- Boiling Point/Range : > 100 °C (1,013 hPa)
- Physical Form : Liquid
- Flashpoint : Not applicable
- Density : 1.250 g/cm3 (20 °C)
- Color : Colorless
- Odor : Weak
- Incompatible Materials : Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
- Thermal Decomposition : To avoid thermal decomposition, do not overheat.
- Ignition Temperature : Not applicable
- Corrosivity : Corrosive to metals
- Harmonized System Code : 38249996
- Chemical Class : 8
- Packing Group : II
- Sub Class 1 : 6.1
- UN Number : 2922
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
9/7/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
9/7/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
9/7/2022
