PTM6880 makes pump-out a thing of the past

Honeywell is proud to introduce PTM6880, an advanced PCM that provides superior reliability, and maintains low thermal impedance (<0.06˚C.cm2/W@ no shim), making it an ideal choice for high-performance integrated circuit (HPC) devices.

Pump-out leads to poor performance of the devices

Pump-out issues with thermal interface materials (TIMs) pose a challenge because they disrupt the efficient transfer of heat between components, potentially leading to overheating and component failure. This phenomenon occurs when the TIM is forced out of the interface gap, creating air voids that act as thermal insulators. This can happen due to thermal expansion and contraction of the interface surfaces, especially with rapid temperature changes.

Addressing these challenges requires an innovative approach to thermal design to ensure efficient cooling in HPCs.

Introducing PTM6880 - a next-generation PCM

During trials, major GPU producers and data center companies endorsed PTM6880 for its superior thermal resistance and better hotspot distribution, over the next best PCM alternative.

Improve thermal resistance against pump out/vertical flow at interfaces: PTM6880 provides a reliable solution by maintaining consistent flatness between the chip and heatsink, even in tight applications needing less than 0.1mm tolerance.

Provides better hotspot distribution: PTM6880 effectively spread heat away from localized high-temperature areas on electronic components to help prevent thermal failure, enhance device performance, and extend the lifespan of electronic devices.

Maintain stable thermal performance required for longer product life applications: With PTM6880, you can achieve efficient heat dissipation, ensuring optimal performance for your chips while minimizing the risks associated with overheating.

Enhance production efficiency: PTM6880 is instrumental in streamlining automated processes while drastically reducing the risk of damage to the bare die. It also decreases the need for rework and repairs, making it the ideal choice for modern high-performance applications.

Based on a novel polymer PCM system, this material exhibits excellent interface wettability during typical operating temperature ranges, resulting in the low surface contact resistance especially for small level range gap applications, including:

AI Servers GPU/CPU, Supercomputing
EV Inverter, onboard charger (OBC), DC/DC converters
Switches, routers, base stations
IGBT Power Module

PTM6880 properties at a glance

Properties	PTM6880
Thermal impedance	0.056 °C∙cm²/W
Density	2.7 g/cm³
Thermal conductivity	6 W/m∙K
Bond line thickness (@60°C, 20psi)	20 μm

Connect with us

Unlock the full potential of your next-generation devices with Honeywell PTM6880. This advanced PCM has what you need to gain an edge in performance. Contact us today to evaluate PTM6880 for your applications and to discover how this advanced PCM can transform your device’ performance.